Electronics Cooling with Multi-Phase Heat Exchange and Heat Spreader

ABSTRACT

One example aspect of the present disclosure is directed to a system for cooling a surface. The system can include a housing. The housing can include an evaporator portion. The housing can include at least one trifurcated heat exchange portion. The at least one trifurcated heat exchange portion can include a condenser portion coupled to the evaporator portion. The at least one trifurcated heat exchange portion can include a coolant portion substantially surrounded by the condenser portion. The at least one trifurcated heat exchange portion can include a phase change material portion substantially surrounding the condenser portion.

This application claims the benefit of priority of U.S. ProvisionalApplication No. 62/352,862 filed Jun. 21, 2016, which is incorporated byreference.

TECHNICAL FIELD

The subject disclosure generally relates to a compact and efficientmethod to cool heat producing components via three dimensional conformalvapor chamber heat spreaders closely coupled with multi-domain heatexchangers.

BACKGROUND

In typical convection cooling systems, heat is often spread, shifted orotherwise transferred from heat producing components to a series of finsfor heat removal. Air outside the fins lifts, carries away or otherwiseremoves the heat from the fins. In some situations, the air may becooled, for example, by an air conditioning system, wherein the air actsan intermediary fluid to carry the heat to a heat exchanger included inthe air conditioning system. It is readily apparent that this can beinefficient, and require additional space and weight overhead.Additionally, in applications where the air outside the fins is hotterthan the heat being ejected, a convection cooling system can beineffective. For example, where the local ambient environment is subjectto additional heat producing components, the convection cooling systemmay be unable to effectively remove heat form the heating producingcomponent to which it is coupled.

SUMMARY

The following presents a simplified summary of the specification inorder to provide a basic understanding of some aspects of thespecification. This summary is not an extensive overview of thespecification. It is intended to neither identify key or criticalelements of the specification nor delineate any scope particularembodiments of the specification, or any scope of the claims. Its solepurpose is to present some concepts of the specification in a simplifiedform as a prelude to the more detailed description that is presentedlater.

One example aspect of the present disclosure is directed to a system forcooling a surface. The system can include a housing. The housing caninclude an evaporator portion. The housing can include at least onetrifurcated heat exchange portion. The at least one trifurcated heatexchange portion can include a condenser portion coupled to theevaporator portion. The at least one trifurcated heat exchange portioncan include a coolant portion substantially surrounded by the condenserportion. The at least one trifurcated heat exchange portion can includea phase change material portion substantially surrounding the condenserportion.

Another example aspect of the present disclosure is directed to a systemfor cooling a surface. The system can include a first structure forminga first cavity. Coolant can be disposed in the first cavity. The systemcan include a second structure. A first chamber can be formed between atleast portions of the first structure and at least portions of thesecond structure. The first chamber can include a heat transfersubstance. The system can include a third structure. A second chambercan be formed between at least portions of the second structure and atleast portions of the third structure. The second chamber can include aphase change material. The system can include a fourth structure forminga second cavity. The second cavity can be in communication with thefirst chamber. The fourth structure can be in communication with thesurface. The second cavity can include the heat transfer substance.

Another example aspect of the present disclosure is directed to a systemfor cooling electronics. The system can include a multi-phase heatexchanger. The system can include a heat spreader. The heat spreader caninclude a vapor chamber.

Other example aspects of the present disclosure are directed to systems,methods, power plants, devices, non-transitory computer-readable mediafor cooling a surface. Variations and modifications can be made to theseexample aspects of the present disclosure.

The following description and the annexed drawings set forth certainillustrative aspects of the specification. These aspects are indicative,however, of but a few of the various ways in which the principles of thespecification may be employed. Other advantages and novel features ofthe specification will become apparent from the following detaileddescription of the specification when considered in conjunction with thedrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates example exploded views of the heat exchanger domainsin accordance with various aspects described herein.

FIG. 2 illustrates example exploded views of the heat exchanger domainsin accordance with various aspects described herein.

FIG. 3 illustrates an example trifurcated, multi-domain heat exchangerstructure in accordance with various aspects described herein.

FIG. 4 illustrates an example trifurcated, multi-domain pathrepresentation in accordance with various aspects described herein.

FIG. 5 illustrates an example cross section of a three-dimensionalconformal vapor chamber in accordance with various aspects describedherein.

FIG. 6 illustrates an example schematic of a combined trifurcated heatexchanger and three-dimensional conformal vapor chamber in accordancewith various aspects described herein.

FIGS. 7-9 illustrate example schematics of additional configurations ofthe combined trifurcated heat exchanger and three-dimensional conformalvapor chamber in accordance with various aspects described herein.

FIG. 10 illustrates an example schematic of additional configurations ofthe combined trifurcated heat exchanger and three-dimensional conformalvapor chamber having a vacuum shroud in accordance with various aspectsdescribed herein.

DETAILED DESCRIPTION

The innovation is now described with reference to the drawings, whereinlike reference numerals are used to refer to like elements throughout.In the following description, for purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of the subject innovation. It may be evident, however,that the innovation can be practiced without these specific details. Inother instances, well-known structures and devices are shown in blockdiagram form in order to facilitate describing the innovation.

As used in the specification and the appended claims, the singular forms“a,” “an,” and “the” include plural referents unless the context clearlydictates otherwise. As used herein, when a first structure is“substantially surrounding” a second structure, then the first structuresurrounds at least 66% of the second structure. As used herein, when afirst structure is “substantially surrounded by” a second structure,then at least 66% of the first structure is surrounded by the secondstructure.

As noted in the Background section, typical convection cooling systemsremove heat by transferring it from heat producing components to aseries of fins. Air outside the fins lifts, carries away or otherwiseremoves the heat from the fins. In applications where the air outsidethe fins is not significantly hotter than the fins, a convection coolingsystem can be ineffective. For example, where the ambient environment issubject to additional heat producing components, the convection coolingsystem may be unable to effectively remove heat from the heat producingcomponent to which it is coupled. Cooling the air via an airconditioning system can be inefficient, and require additional space andweight overhead.

Accordingly, one non-limiting intent of the disclosed subject matter isto provide for efficient heat transfer from a hot spot to one or moredomains of a heat exchanger system. A first domain of the heat exchangersystem can include a vapor chamber. A second domain of the heatexchanger system can include a fluid cooling (or heating) loop forproviding efficient cooling (or heating) for the vapor chamber, and thusfor an electronic component. A third domain of the heat exchanger systemcan include a phase change material. A fourth domain of the heatexchanger system can include a vacuum.

In one embodiment, the vapor chamber can be a three dimensional (3D)Conformal Vapor Chamber (CVC) configured in such a way that anevaporator section of the 3D CVC is closely mated to an electroniccircuit board or to a set of electronic components (e.g., heatgenerating components), so that the 3D CVC can provide cooling to theelectronic circuit board or set of electronic components. The evaporatorsection and a condenser section of the 3D CVC can be configured to formthe first domain of a heat exchanger system. The 3D CVC and the heatexchanger system can be realized in a single part, component or piecevia additive manufacturing.

In an additional or alternative embodiment, the 3D CVC Evaporator isconnected to a 3D CVC condenser which forms one domain of a multi-domain(e.g., 2 or more domains) heat exchanger. For example, at least one ofthe remaining or other domains of the heat exchanger can be used toprovide the 3D CVC condenser with a cooling fluid. Additionally oralternatively, at least one of the remaining heat exchanger domains canbe filled with a Phase Change Material (PCM). For instance, the PCM canbe of a reversible type (e.g., paraffin wax, etc.) or of theirreversible type (e.g., water being evaporated, with the vapor beingdispersed into the environment). Virtually any PCM can be used withinthe scope of this innovation. In another example, at least one of theremaining heat exchanger domains can be a vacuum.

Some embodiments can include a nested, trifurcated heat exchanger (HX)(or a trifurcated heat exchange portion), wherein the flow path for eachfluid includes short flow lengths followed by hydrodynamic furcationsthat divide the flow and disrupt, interrupt or otherwise break thethermal boundary layer of the fluid. The paths can combine with otheradjacent sections to form a new or additional short path, and thedivision and recombination of paths can be repeated. A similar patternmay be followed by other fluid/volume(s) with thin walls separatingeach. The heat exchanger can be applied to two fluid systems by plumbingat least two of the fluid domains to the same fluid source. Likewise,the heat exchanger can be applied to 3 or more fluids. A furtherembodiment includes using a phase change material in one of the volumedomains, thus providing additional thermal capacitance over a particulartemperature range. Other substances, or voids, can also be used asrequired in one or more of the volume domains. In an embodiment, thetrifurcated heat exchanger can be surrounded by a vacuum—the vacuum canbe the fourth domain.

In this way, the systems and methods according to example aspects of thepresent disclosure can have a number of technical effects and benefits.For instance, example aspects of the present disclosure can have atechnical effect of cooling hot electronics to prevent damage to theelectronics due to overheating.

In some embodiments, the systems and methods of the present disclosurealso provide an improvement to a computing system. The system includes ahousing. A housing can be an external wall surrounding one or morecomponents. The housing includes an evaporator portion. The housingincludes at least one trifurcated heat exchange portion. The at leastone trifurcated heat exchange portion includes a condenser portioncoupled to the evaporator portion. The at least one trifurcated heatexchange portion includes a coolant portion substantially surrounded bythe condenser portion. The at least one trifurcated heat exchangeportion includes a phase change portion substantially surrounding thecondenser portion. This can help prevent damage to electronics of thecomputing system due to overheating.

One example aspect of the present disclosure is directed to a system forcooling a surface. The system can include a housing. The housing caninclude an evaporator portion. The housing can include at least onetrifurcated heat exchange portion. The at least one trifurcated heatexchange portion can include a condenser portion coupled to theevaporator portion. The at least one trifurcated heat exchange portioncan include a coolant portion substantially surrounded by the condenserportion. The at least one trifurcated heat exchange portion can includea phase change portion substantially surrounding the condenser portion.

In some embodiments, at least one of the evaporator portion and thecondenser portion includes a heat exchange fluid. In some embodiments,at least one of the evaporator portion and the condenser portionincludes at least one wall partially or fully lined with threedimensional conformal vapor chamber wicking structures. In someembodiments, the phase change material portion includes a phase changematerial. In some embodiments, the phase change material is of areversible type. In some embodiments, the phase change material includesparaffin wax. In some embodiments, the phase change material is of anirreversible type. In some embodiments, the phase change materialcomprises water. In some embodiments, the housing can father include avacuum portion.

Another example aspect of the present disclosure is directed to a systemfor cooling a surface. The system can include a first structure forminga first cavity. Coolant can be disposed in the first cavity. The systemcan include a second structure. A first chamber can be formed between atleast portions of the first structure and at least portions of thesecond structure. The first chamber can include a heat transfersubstance. The system can include a third structure. A second chambercan be formed between at least portions of the second structure and atleast portions of the third structure. The second chamber can include aphase change material. The system can include a fourth structure forminga second cavity. The second cavity can be in communication with thefirst chamber. The fourth structure can be in communication with thesurface. The second cavity can include the heat transfer substance.

In some embodiments, at least one of the first chamber and the secondcavity includes a condenser. In some embodiments, at least one of thefirst chamber and the second cavity includes at least one wall partiallyor fully lined with three dimensional conformal vapor chamber wickingstructures.

Another example aspect of the present disclosure is directed to a systemfor cooling electronics. The system can include a multi-phase heatexchanger. The system can include a heat spreader can include a threedimensional conformal vapor chamber.

In some embodiments, the three dimensional conformal vapor chamber isclosely coupled with one or more multi-domain heat exchangers. In someembodiments, at least one of the domains includes a condenser of thevapor chamber. In some embodiments, at least one of the domains includesa coolant. In some embodiments, at least one of the domains includesphase change material. In some embodiments, the one or more multi-domainheat exchangers include three domains. In some embodiments, at least oneof the multi-phase heat exchanger and the three dimensional conformalvapor chamber are at least partially enclosed in a vacuum domain. Insome embodiments, the vacuum domain provides thermal insulation betweenan environment and at least one of the multi-phase heat exchanger andthe three dimensional conformal vapor chamber.

In FIG. 1, a first structure 100 can include a cavity 105. The cavity105 can be a coolant portion. The cavity 105 can include coolant 110. Asecond structure 120 can substantially surround the first structure 100to form a first chamber 125. The first chamber 125 can be a condenserportion. The first chamber 125 can be coupled to an evaporator portion.At least one of the evaporator portion and the condenser portion caninclude a heat exchange fluid 130. At least one of the evaporatorportion and the condenser portion can include at least one wallpartially or fully lined with three dimensional conformal vapor chamberwicking structures. A second chamber, formed between a housing and thesecond structure, can be a phase change material portion. The phasechange material portion can include a phase change material 150. Thephase change material 150 can be of a reversible type. The phase changematerial 150 can be paraffin wax. The phase change material 150 can beof an irreversible type. The phase change material 150 can includewater. In FIG. 1, one unit cell is represented; however, it is to beappreciated that virtually any number of unit cells can be replicated toprovide adequate heat transfer surfaces within the scope of thisinnovation. FIG. 2 illustrates how the coolant 200 can be shaped by afirst cavity, how the heat exchange fluid 210 can be formed by the firstchamber, and how the phase change material 220 can be formed by thesecond chamber. In FIG. 2, coolant 200, heat exchange fluid 210, andphase change material 220 manipulated by two unit cells are represented;however, it is to be appreciated that virtually any number of unit cellscan be replicated to provide adequate heat transfer surfaces within thescope of this innovation.

FIG. 3 illustrates example trifurcated, multi-domain heat exchangerstructure 300 in accordance with various aspects described herein. Thetrifurcated, multi-domain heat exchanger structure 300 can include acoolant portion 310, a condenser portion 320, and a phase changematerial portion 330. In FIG. 3, eight unit cells are represented;however, it is to be appreciated that virtually any number of unit cellscan be replicated to provide adequate heat transfer surfaces within thescope of this innovation. Error! Reference source not found. FIG. 4illustrates example trifurcated, multi-domain heat exchanger pathrepresentations in accordance with various aspects described herein.Particularly, FIG. 4 illustrates a heat exchanger 400, wherein separatefluid domains are illustrated. For instance, three separate domains areshown: a coolant domain 410, a vapor chamber (or condenser orevaporator) domain 420, and a phase change material domain 430. It canbe appreciated that the domains are completely separated by the heatexchanger wall within the array of unit cells, but each domain is fullyconnected in the array. Additionally, it is to be appreciated thatalthough FIGS. 1-4 illustrate three domains, virtually any quantity ofdomains are within the scope of the present innovation. Further,although FIGS. 1-4 illustrate three domains in a particular order (i.e.,phase change material domain in the outermost layer, coolant domain inthe innermost later, etc.), any or all of the three domains present inany order are within the scope of the present innovation. FIGS. 1-2illustrate example exploded views of the heat exchanger domains inaccordance with various aspects described herein.

Turning now to FIG. 5, illustrated is an example cross section of athree dimensional conformal vapor chamber (3D CVC) 500 in accordancewith various aspects described herein. The cross section includes anevaporator section 506 and condenser sections 508 of the 3D CVC 500. Theevaporator section 506 can be in communication with hot components 502,504. The 3D CVC 500 can be an enclosed, hermetic vessel that has some orall of its internal surfaces lined with a wicking structure. Thehermetic enclosure is initially evacuated and then charged with ameasured amount of working fluid, for example distilled water. Due tothe low pressure within the 3D CVC 500, some of the working fluid willevaporate, until the vapor pressure brings the 3D CVC 500 toequilibrium. When heat is applied to the evaporator section 506, moreworking fluid evaporates and thus absorbs heat from the evaporatorsection 506. The vapor moves within the 3D CVC 500 due to pressuregradients from the evaporation and condensation process. When the vaporreaches the condenser sections 508, it rapidly condenses, releasing heatto the condenser sections 508. Capillary forces within the wickingstructure draw the fluid back to the evaporator section 506, where thecycle can repeat.

In FIG. 5, an evaporator section 506 is illustrated as a center section,and the side sections are illustrated as the condenser sections 508.Heat is represented by short-straight arrows going into or entering theevaporator section 506. Vapor creation is represented by solid arrows inthe evaporator section 506 and condenser sections 508 and liquid isrepresented by dashed arrows in the evaporator section 506 and condensersections 508, wherein evaporation of the fluid absorbs heat from theevaporator section 506. The condenser sections 508 are cooler than theevaporator section 506, therefore the vapor condenses and deposits heatin the condenser sections 508, as shown by the longer wavy arrowsradiating away from the condenser sections 508.

In an embodiment of the subject innovation, one or more trifurcatednested heat exchangers (as shown in FIGS. 3-4) can replace a set ofhollow fins used in a conventional heat exchanger arrangement. Returningto FIG. 4, the interior walls of one of the HX fluid domains, forexample the condenser domain 420, can be fully lined with 3D CVC wickingstructures, and the condenser domain 420 can be terminated into amanifold that joins to the 3D CVC 500 in such a way that there is acontinuous layer of wick throughout the whole 3D CVC 500 and thecondenser domain 420. Continuing, with this example, the coolant domain410 can contain a cooling fluid, pumped from the outside of the HX andused to cool walls between the condenser domain 420 and the coolantdomain 410 during normal operation. In addition, the phase changematerial domain 430 can contain a phase change material (PCM), with aphase transition temperature higher than the normal temperature of thecoolant. During normal operation, a temperature of the coolant can below enough, and the mass flow can be high enough, to maintain thecondenser domain 420 below the transition temperature of the PCM whileextracting the heat generated by the heat generating components (e.g.,electronics, etc.) connected to the evaporator section 506 andtransported to the condenser section 508 by the vapor inside the 3D CVC500. If the condenser domain 420 temperature reaches the phasetransition temperature of the PCM, due, for example, to increasedthermal load at the condenser domain 420 or diminished coolant capacityin the coolant domain 410, then the PCM starts to transition and absorbsheat from the condenser domain 420 while maintaining it at the phasetransition temperature until all of the PCM has transitioned phase. Inan embodiment, trifurcated HX structure can have a very large surfacearea (e.g., the interface between the condenser domain 420 and the phasechange material domain 430) to the PCM, and the thickness of individualPCM sections can be small, so heat can be transferred into the PCM veryefficiently, enabling its operation under large heat fluxes.

Various sides of the trifurcated HX can be configured to form manifoldsfor the various working fluids within the HX. The manifold thatencompasses the PCM domain can include an expansion area to allow forchanges in volume of the PCM as it transitions through its phases. ThePCM domain can be sealed (e.g., in the case of a reversible PCM) orvented to the environment (e.g., in the case of an evaporative orablative PCM).

FIG. 6 illustrates an example schematic of combined trifurcated heatexchanger (HX) and three dimensional conformal vapor chamber (3D CVC)600 in accordance with various aspects described herein. A surface of ahot component 602 can be in communication with a surface of anevaporator 604 of the combined trifurcated heat exchanger (HX) and threedimensional conformal vapor chamber (3D CVC) 600. Vapor from the insidewalls of the evaporator 604 diffuses into a condenser section of the HX606, and condenses on either or both of an interface with a coolantsection and an interface with a phase change material section. In atypical system there will be various conduction mechanisms (cold plates,etc.) that go into a loop of coolant and that loop of coolant will gointo a HX, and that HX will exchange heat with another coolant fluid. Anadvantage of the present innovation is to remove the inner coolant loopand enable the heat generating components to transfer heat to the heatexchanger itself. Additionally, it will be apparent that the notation ofevaporator and condenser can be notional/relative. For instance, at afirst time, if the phase change material domain contains a PCM that ishot (e.g., melted due to heat absorption), and the coolant domain iscool, then at the first time the interface with the phase change domaincan act as an evaporator, and the interface with the coolant domain canact as a condenser.

FIG. 7 illustrates an example HX and 3D CVC 700 like the one of FIG. 6in communication with an electronic component 710. The example HX and 3DCVC 700 includes a housing 720, an evaporator 730, and a trifurcatedheat exchanger 740. FIG. 8 illustrates an example HX and 3D CVC 800 withtwo evaporators 830, each evaporator 830 in communication with anelectronic component 810. The example HX and 3D CVC 800 further includesa housing 820 and a trifurcated heat exchanger 840. Although FIG. 6illustrates the HX on one side, it can be on multiple sides, or allsides, and can be determined as a function of the amount desired to besubtracted or removed. For example, FIG. 9 illustrates an example HX and3D CVC 900 with a HX 940 on multiples sides in communication with anelectronic component 910. The example HX and 3D CVC 900 further includesa housing 920 and an evaporator 930. FIG. 10 illustrates an example HXand 3D CVC 1000 in communication with two electronic components 1010.The example HX and 3D CVC 1000 includes a housing 1020, two evaporators,a trifurcated heat exchanger 1040, and a vacuum domain 1050. Portions orall of the device described in FIG. 6 can be further enclosed in avacuum domain (or vacuum shroud) to provide thermal insulation betweenthe HX/3D CVC and the environment (e.g., as shown in FIG. 10). In oneapproach, the outermost domain of the nested Trifurcated HX could beevacuated and sealed. In another approach, an additional shroudencompassing the exterior of the nested trifurcated HX would beadditively manufactured and used to contain a vacuum (e.g., similar to aDewar bottle). The areas of the device enclosed by the vacuum domainwould vary with the application. Additionally, while three fluid domainsare shown, multiple fluid domains can be used for the same fluid tocreate additional surface area. For example, in one arrangement onefluid domain can be connected to the vapor chamber, and the other twocould be connected to a first fluid. As an additional example, one fluiddomain could be connected to the vapor chamber, and each of the otherdomains can include separate fluids. As yet another example, one domaincan include a phase change material, one domain can be connected to thevapor chamber, and another domain can contain a separate fluid.

It is to be further appreciated that the multi-domain heat exchanger ofthe current innovation can include virtually any number of domains. Forexample, the multi-domain heat exchanger can include two domains,wherein one domain essentially acts as the condenser of a heat pipe, andthe other domain includes coolant. Furthermore, a two domain heatexchanger can include any combination of the domains illustrated in FIG.6 (e.g., any combination of fluids).

Despite the condenser (or vapor chamber) domain being illustrated asincluded in the middle domain, the condenser domain can be in virtuallyany domain, and can be selected based at least in part on the details ofa particular application. The heat exchanger sections can be connectedto multiple sides of the 3D CVC in quantities and shapes that fit theapplication. For example, if multiple HX sections are used, then the HXdomains can be connected or separate, and the 3DCVC domainscorresponding to the various HX sections can also be connected orseparated. It is possible, in a single instantiation of this innovation,to have multiple 3D CVC domains each served by its own HX andcombination of coolants and PCMs.

Multiple operating modes are possible within the scope of the currentinnovation. For example, during a first time period where there is ahigh heat dissipation period, virtually all of the heat from heatgenerating components can be transferred to the domain containing thePCM. During this operating mode, the HX may not be functioning,operating, or otherwise working. When the period is over, the operatingmode can control, influence or otherwise instruct fluid through the HXin order to re-solidify the PCM. Typically, PCM is good for a singleuse; however, the example operating mode would enable a way tore-solidify the PCM when needed.

What is claimed is:
 1. A system for cooling a surface comprising: ahousing comprising: an evaporator portion; and at least one trifurcatedheat exchange portion comprising: a condenser portion coupled to theevaporator portion; a coolant portion substantially surrounded by thecondenser portion; and a phase change material portion substantiallysurrounding the condenser portion.
 2. The system of claim 1, wherein atleast one of the evaporator portion and the condenser portion comprisesa heat exchange fluid.
 3. The system of claim 1, wherein at least one ofthe evaporator portion and the condenser portion comprises at least onewall at least partially lined with vapor chamber wicking structures. 4.The system of claim 1, wherein the phase change material portioncomprises a phase change material.
 5. The system of claim 4, wherein thephase change material is of a reversible type.
 6. The system of claim 5,wherein the phase change material comprises paraffin wax.
 7. The systemof claim 4, wherein the phase change material is of an irreversibletype.
 8. The system of claim 7, wherein the phase change materialcomprises water.
 9. The system of claim 1, wherein the housing furthercomprises a vacuum portion.
 10. A system for cooling a surfacecomprising: a first structure forming a first cavity, wherein coolant isdisposed in the first cavity; a second structure, wherein a firstchamber is formed between at least portions of the first structure andat least portions of the second structure, and wherein the first chambercomprises a heat transfer substance; a third structure, wherein a secondchamber is formed between at least portions of the second structure andat least portions of the third structure, wherein the second chambercomprises a phase change material; and a fourth structure forming asecond cavity, wherein the second cavity is in communication with thefirst chamber, wherein the fourth structure is in communication with thesurface, and wherein the second cavity comprises the heat transfersubstance.
 11. The system of claim 10, wherein at least one of the firstchamber and the second cavity comprises a condenser.
 12. The system ofclaim 10, wherein at least one of the first chamber and the secondcavity comprises at least one wall at least partially lined with vaporchamber wicking structures.
 13. A system for cooling electronicscomprising: a multi-phase heat exchanger; and a heat spreader comprisinga vapor chamber.
 14. The system of claim 13, wherein the vapor chamberis in communication with one or more multi-domain heat exchangers. 15.The system of claim 14, wherein at least one of the domains comprises acondenser of the vapor chamber.
 16. The system of claim 14, wherein atleast one of the domains comprises a coolant.
 17. The system of claim14, wherein at least one of the domains comprises phase change material.18. The system of claim 14, wherein the one or more multi-domain heatexchangers comprise three domains.
 19. The system of claim 13, whereinat least one of the multi-phase heat exchanger and the vapor chamber areat least partially enclosed in a vacuum domain.
 20. The system of claim19, wherein the vacuum domain provides thermal insulation between anenvironment and at least one of the multi-phase heat exchanger and thevapor chamber.